CAPEL FPC & flex Rigid PCB Production Capability
| Productum | Princeps Density | |||
| Interconnect (HDI) | ||||
| Vexillum flex ambitus flex | Flat Circuitus flexibilia | Rigidum flex Circuit | Membrana SWITCH | |
| Standard Panel Size | 250mm X 400mm | Volvunt fomat | 250mmX400mm | 250mmX400mm |
| linea latitudine et spatio | 0.035mm 0.035mm | 0 .010"(0.24mm) | 0.003"(0.076mm) | 0.10"(.254mm) |
| Crassitudo aeris | 9um/12um / 18um / 35um / 70um/100um/140um | 0.028mm-.01mm | 1/2 oz.and altiorem | 0.005"-.0010" |
| Layer comitis | 1-32 | 1-2 | 2-32 | 1-2 |
| VIA / EXERCITATIO MENSURA | ||||
| Minimum EXERCITATIO ( Mechanica ) Hole Diameter | 0.0004" (0.1 mm) 0.006" (0.15 mm) | N / A | 0.004" (0.15 mm) | 10 mil (0,25 mm) |
| Minimum Via ( Laser ) Size | 4 mil ( 0.1mm ) 1 mil ( 0.025 mm ) | N / A | 6 mil ( 0.15 mm ) | N / A |
| Minimum Micro Via ( Laser ) Size | 3 mil (0.076 mm) 1 mil (0.025 mm) | N / A | 3 mil (0.076 mm) | N / A |
| Stiffener Material | Polyimide / FR4 / Metal / SUS / Alu | PET | FR-4 / Poyimide | PET / Metal/FR-4 |
| protector materiales | Aeris / argenteus Lnk / Tatsuta / Carbon | Argentum ffoyle / Tatsuta | Aeris / Argenti Ink/Tatduta / Carbon | Argentum ffoyle |
| Tooling Material | 2 mil ( 0.051 mm ) 2 mil ( 0.051 mm ) | 10 mil (0.25mm) | 2 mil (0.51 mm) | 5 mil ( 0.13 mm ) |
| Zif Tolerantia | 2 mil ( .051 mm ) 1 mil ( 0.025 mm ) | 10 mil (0.25mm) | 2 mil (0.51 mm) | 5 mil ( 0.13 mm ) |
| SOLIDARIUS PERSONA | ||||
| Venditor larva pontem Inter Dam | 5 mil ( .013 mm ) 4 mil ( 0 .01mm ) | N / A | 5 mil ( 0.13 mm ) | 10 mil (0.25mm) |
| Venditor larva Registration TOLERATIO | 4 mil ( .010 mm ) 4 mil ( 0.01mm ) | N / A | 5 mil ( 0.13 mm ) | 5 mil ( 0.13 mm ) |
| COVERLAY | ||||
| Coverlay Registration | 8 mil 5 mil | 10 mil | 8 mil | 10 mil |
| PIC Registration | 7 mil 4 mil | N / A | 7 mil | N / A |
| Venditor larva Registration | 5 mil 4 mil | N / A | 5 mil | 5 mil |
| Superficiem Conclusio | ENIG/Immissio Argentea/Immissio plumbi/Aurum Plating/stannum Plating/OSP/ENEPIG | |||
| Legend | ||||
| Altitudo minimum | 35 mil 25 mil | XXXV mil | XXXV mil | Graphic Overlay |
| Minimun latitudo | 8 mil 6 mil | 8 mil | 8 mil | |
| Minimum Space | 8 mil 6 mil | 8 mil | 8 mil | |
| Registration | ±5m±5m | ±5mil | ±5mil | |
| Impedimentum | ±10% ± 10% | ±20% | ±10% | NA |
| SRD ( Steel Rule Die ) | ||||
| Forma TOLERATIO | 5 mil ( 0.13 mm ) 2 mil ( 0.051 mm ) | N / A | 5 mil ( 0.13 mm ) | 5 mil ( 0.13 mm ) |
| Radii minimum | 5 mil ( 0.13 mm ) 4 mil ( 0.10 mm ) | N / A | 5 mil ( 0.13 mm ) | 5 mil ( 0.13 mm ) |
| Radius intus | XX mil ( 0.51 mm ) X mil ( 0.25 mm ) | N / A | 31 mil | 20 mil ( 0.51 mm ) |
| Punch Minimum foramen Location | 40 mil ( 10.2 mm ) 31.5 mil (0.80 mm) | N / A | N / A | 40 mil (1.02 mm ) |
| TOLERATIO Punch Hole Location | ± 2mille (0.051 mm) ± 1 mil | N / A | N / A | ± 2 mil (0.051 mm) |
| socors Latitudo | XX mil ( 0.51 mm ) XV mil ( 0.38 mm ) | N / A | 31 mil | 20 mil ( 0.51 mm ) |
| Toleranc foraminis ad formam | ±3 mil±2 mil | N / A | ±4 mil | 10 mil |
| Tolerantia foraminis ore adumbrare | ±4 mil±3 mil | N / A | ±5 mil | 10 mil |
| Minimum Vestigium ad formam | 8 mil 5mil | N / A | 10 mil | 10 mil |
CAPEL PCB Productio Capability
| Technical Parameters | ||
| Nec. | Project | Technical Indicatores |
| 1 | Layer | 1－60 (iaccum) |
| 2 | Maxime processus regio | 545 x 622 mm |
| 3 | Minimumboardthickness | 4(layer)0.40mm |
| 6(layer) 0.60mm | ||
| 8(lay) 0.8mm | ||
| 10(layer) 1.0mm | ||
| 4 | Minimum linea latitudo | 0.0762mm |
| 5 | Minimum spacing | 0.0762mm |
| 6 | Mechanica foramen minimum | 0.15mm |
| 7 | Murus aeris crassitudo | 0.014mm |
| 8 | Foramen metallicum tolerantia | ±0.05mm |
| 9 | Non metallis tolerantia foraminis | ±0.025mm |
| 10 | Foraminis tolerantia | ±0.05mm |
| 11 | Dimensiva tolerantia | ±0.076mm |
| 12 | Pontem solidarium minimum | 0.08mm |
| 13 | Nulla resistentia | 1E+12Ω（normal） |
| 14 | Ratio laminae crassitudinis | 1:10 |
| 15 | scelerisque inpulsa | CCLXXXVIII -4 temporibus per X seconds） |
| 16 | Depravata et incurvata | ≤0.7% |
| 17 | Anti-electricitatis viribus | ＞1.3KV/mm |
| 18 | Anti- expoliantes vires | 1.4N/mm |
| 19 | Venditor resistere duritiem | ≥6H |
| 20 | Flamma retardatio | 94V-0 |
| 21 | Impedimentum imperium | ±5% |
CAPEL PCBA Productio Capability
| Categoria | Singula | |
| Duc Tempus | 24 horas Prototyping, tempus partus parvae fasciae est circiter 5 dierum. | |
| PCBA Capacitas | SMT plenitudinem 2 decies centena puncta/diei, THT 300,000 puncta/diei, 30-80 ordines/diei. | |
| Component Service | Turnkey | Perfecta et efficax ratio administrationis procurationis componentis, inceptis maximis effectibus PCBA servimus.Manipulus procurationis fabrum professionalium et curatores periti procurationis est auctor partium pro nostris clientibus procurationi et administrationi. |
| Kitted aut Consigned | Cum valida procuratione administratione manipulorum et instrumentorum componentium catenae, Customers nobis componentibus praebent, opus conventus agimus. | |
| Combo | Recipe partes seu partes speciales a clientibus praebentur.and also tium subsidia pro clientibus. | |
| PCBA Solder Type | SMT, THT, seu PCBA solidatoria utriusque officia. | |
| Solder Crustulum / plumbum filum / plumbum Bar | plumbum et liberum (RoHS obsequentem) officia processus PCBA.Ac etiam crustulum solidi nativus providebit. | |
| Stencil | laser stencil secans curare ut componentibus minimis picis ICs et BGA occurrant IPC-2 Classis vel superior. | |
| MOQ | Pars una, sed monemus clientibus nostris ut exempla 5 saltem pro analysi sua et experimento producant. | |
| Component Size | • Partes passivas: nos bonus es congruens inch 01005 (0.4mm *0.2mm), 0201 tam parvae partes. | |
| • Summus praecisio ICs ut BGA: deprehendere possumus BGA partes cum Min 0.25mm spatio per X-radium. | ||
| Pars Package | reel, taenia, tubinga, et grabatis in sMT composita. | |
| Maximum montem Accuracy of Components (100FP) | Sagax est 0.0375mm. | |
| PCB Type vendibilis | PCB (FR-4, substrati metalli), FPC, Rigid-flex PCB, Aluminium PCB, HDI PCB. | |
| Layer | 1－30（layer） | |
| Maxime processus regio | 545 x 622 mm | |
| Minimumboardthickness | 4(layer)0.40mm | |
| 6(layer) 0.60mm | ||
| 8(lay) 0.8mm | ||
| 10(layer) 1.0mm | ||
| Minimum linea latitudo | 0.0762mm | |
| Minimum spacing | 0.0762mm | |
| Mechanica foramen minimum | 0.15mm | |
| Murus aeris crassitudo | 0.014mm | |
| Foramen metallicum tolerantia | ±0.05mm | |
| Non metallized foraminis | ±0.025mm | |
| Foraminis tolerantia | ±0.05mm | |
| Dimensiva tolerantia | ±0.076mm | |
| Pontem solidarium minimum | 0.08mm | |
| Nulla resistentia | 1E+12Ω（normal） | |
| Ratio laminae crassitudinis | 1:10 | |
| scelerisque inpulsa | CCLXXXVIII -4 temporibus per X seconds） | |
| Depravata et incurvata | ≤0.7% | |
| Anti-electricitatis viribus | ＞1.3KV/mm | |
| Anti- expoliantes vires | 1.4N/mm | |
| Venditor resistere duritiem | ≥6H | |
| Flamma retardatio | 94V-0 | |
| Impedimentum imperium | ±5% | |
| Tabellae | BOM，PCB Gerber, delige et locum. | |
| Testis | Ante traditionem varias methodos experimentorum adhibebimus ad PCBA in monte vel iam in monte; | |
| • IQC: inspectionem advenientis; | ||
| • IPQC: productio inspectionis, LCR tium primae partis; | ||
| • Visual QC: exercitationis qualitas perscriptio; | ||
| • AOI: effectus solidandi commissuras partium, parvas partes seu verticitatem partium; | ||
| • X-Ray: inspicias BGA, QFN et alia summa cura occultas partes PAD; | ||
| • Munus Testis: Munus Testis et effectus secundum mos probatio procedendi et procedendi ad obsequium obtinendum. | ||
| Reparare & Rework | Officium nostrum BGA Repair tuto removere abalienationem, remotionem, et falsificatum BGA et ad perfecte PCB affigere. | |
